印制電路板(Printed Circuit Boards)

　　IPC-6010 Series IPC-6010 Qualification and Performance Series

　　IPC-6010印制電路板質量標準和性能規范系列手冊

　　IPC-A-600F Acceptability of Printed Boards

　　印制板驗收條件

　　IPC-6011 Generic Performance Specification for Printed Boards

　　印制板通用性能規范

　　IEC/PAS 62214 Generic Performance Specification for Printed Boards

　　印制板總體性能規范

　　IPC-6012A-AM Qualification and Performance Specification for Rigid Printed Boards-Includes Amendment 1

　　剛性印制板的鑒定與性能規范 (包括修改單1)

　　IEC/PAS 62250 Qualification and Performance Specification for Rigid Printed Boards-Includes Amendment 1

　　剛性印制板的鑒定與性能規范

　　IPC-6015 Qualification & Performance Specification for Organic Multichip Module (MCM-L) Mounting and Interconnections

　　有機多芯片模塊(MCM-L)安裝及互連結構的鑒定與性能規范

　　IPC-TF-870 Qualification and Performance of Polymer Thick Film Printed Boards

　　聚合物厚膜印制板的鑒定與性能

　　IPC-QE-605A Printed Board Quality Evaluation Handbook

　　印制板質量評價

　　IPC-PWB-EVAL-CH Printed Wiring Board Defect Evaluation Chart

　　印制線路板瑕疵評價流程圖冊

　　IPC-DW-424 General Specification for Encapsulated Discrete Wire Interconnection Boards

　　封入式分立布線互連板通用規范

　　IPC-DW-425A Design and End Product Requirements for Discrete Wiring Boards

　　印制板分立線路的設計及成品要求(包括修改單1)

　　IPC-DW-426 Specification for Assembly of Discrete Wiring 分立線路組裝規范

　　IPC-HM-860 Specification for Multilayer Hybrid Circuits 多層混合電路規范

　　IPC-TR-470 Thermal Characteristics of Multilayer Interconnection Boards

　　多層互連板熱特性

　　IPC-TR-481 Results of Multilayer Tests Program Round Robin

　　多層印制板聯合試驗計劃結果

　　IPC-TR-551 Quality Assessment of Printed Boards Used for Mounting and Interconnecting Electronic Components

　　用于電子元件安裝與互連的印制板質量評價

　　IPC-TR-578 Leading Edge Manufacturing Technology Report

　　前沿制造技術報告

　　IPC-TR-579 Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in PWBs